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Holst Centre celebrates 20 years sparking new industries, and TNO spin-out Nearfield Instruments secures $380 million Series D funding

Holst Centre at High Tech Campus Eindhoven Holst_Centre

A heartfelt congratulations to Holst Centre’s two decades of sparking new industries! A beautiful example came just one day earlier: TNO spin-off Nearfield Instruments secures $380 million in Series D funding in the largest-ever deep-tech funding round in the Netherlands.

Holst Centre: Sparking new industries

For 20 years, the centre has done what few others can: transform complex R&D into thriving businesses. Founded as a unique collaboration between imec and TNO, Holst Centre pioneered Europe’s open innovation model and continues to translate breakthrough research into real-world impact.

Through spin-offs and ventures such as FononTech, LionVolt, Keiron, AIKON Health and Touchwaves, it has filled value chain gaps and created entirely new markets. Companies including Axelera AI, eyeo, Bloomlife and LifeSense Group demonstrate how this innovation ecosystem continues to generate the next generation of breakthrough ventures.

 

We are proud that so many companies that emerged from, collaborated with, or were inspired by the broader TNO, imec and Holst Centre innovation ecosystem call High Tech Campus Eindhoven home. This includes Nearfield Instruments, FononTech, Axelera AI, eyeo, Keiron, LionVolt, AIKON Health, Touchwaves, Bloomlife, LifeSense Group, Carbyon, Aircision and AMSYSTEMS; companies that started, grew and continue to innovate here.

 

The impact extends even further. Through investments by LUMO Labs at High Tech Campus Eindhoven, companies such as LinkSight, Senexus and Aisyn are helping shape the next generation of deep-tech innovation.

 

Key milestones

  • 2004: Founded at High Tech Campus Eindhoven by imec and TNO
  • 2005–08: First shared industry programmes in ultra-low-power wireless sensing
  • 2009–12; Holst becomes a global reference for flexible electronics and organic OLEDs
  • 2013–16: Strategic pivot to health & wearables: ECG patches, continuous monitoring, neural interfaces
  • 2017–19: Batteryless, energy-harvesting sensors — zero-maintenance IoT becomes real
  • 2019: flexible OLED research reaches the market
  • 2020–22: Covid accelerates the health mission; remote patient monitoring validates years of investment
  • 2023–25: AI at the edge + sustainable/recyclable electronics: the next chapter begins
Nearfield Instruments
Person wearing gear in clean room. Nearfield Instruments, High Tech Camups Eindhoven

Nearfield Instruments secures $380 million Series D funding in largest ever deep-tech funding round in The Netherlands

This press announcement was originally published on Nearfield Instruments’ website. You can read the original article here.

ROTTERDAM, The Netherlands, June 22, 2026 – Nearfield Instruments, a leader in advanced semiconductor 3D metrology and process control, today announced the successful closure of a $380 million Series-D funding round. The transaction values the company at $1.6 billion, marking a major milestone in Nearfield’s development into a global leader in semiconductor metrology and inspection.

This latest round of funding was led by new investor Fidelity Management & Research Company, along with Temasek, Walden Catalyst Ventures, Innovation Industries, M&G Investments, and Invest-NL. Qatar Investment Authority (QIA) participated in this round as a new investor. Other existing investors, TNO Ventures and ING also contributed to this oversubscribed round which represents the largest ever for deep-tech in the Netherlands.

This significant investment marks a major milestone in Nearfield’s development as an emerging global leader in semiconductor metrology and inspection. The funding will serve to accelerate the company’s innovation roadmap, establish worldwide Applications Centers of Excellence, significantly expand production capacity, strengthen its global customer support organization, and deepen collaborative R&D with leading semiconductor manufacturers.

As AI continues to scale, the semiconductor industry must deliver dramatically more computing performance while reducing energy consumption and enabling data to move faster and more efficiently. Nearfield’s innovative metrology and inspection solutions provide the accurate, reliable and high-throughput measurements needed to control advanced processes, improve yield and ensure manufacturability.

By enabling critical measurements for High Numerical Aperture Extreme Ultraviolet (High-NA EUV), Gate-All-Around (GAA) and Complementary Field-Effect Transistor (CFET architectures), and hybrid-bonded 3D integration, Nearfield plays a central role in making the next generation of AI computing scalable, energy-efficient, manufacturable and reliable.

“This highly successful funding round marks a defining moment in our journey and reflects the growing strategic importance of metrology and inspection in the era of AI-driven semiconductor innovation” says Dr. Hamed Sadeghian, Co-Founder and Chief Executive Officer of Nearfield Instruments. “We are proud to welcome the continued support of existing investors and the confidence of new global investors who understand both the scale of the opportunity ahead and the critical role Nearfield is positioned to play in the semiconductor ecosystem.”

“With this investment, we have one clear vision: to serve our customers with the highest execution, reliability, and speed while delivering breakthrough metrology and inspection solutions for the next generation of semiconductor devices. Nearfield is no longer an emerging player—we’re building a global technology company that’s here to stay, scale, and lead.”

Niranjan Sirdeshpande, Head of Catalyst at M&G Investments, comments: “As global semiconductor demand accelerates, the ability to manufacture chips with atomic precision becomes a strategic imperative. Nearfield’s innovative metrology platform directly addresses the process control challenges that advanced chipmakers face as they push toward next-generation nodes and 3D integration architectures. We are confident in the company’s technology, market opportunity, and execution roadmap, and we’re pleased to continue to support Nearfield as it scales its solutions to address this critical manufacturing bottleneck.”

Young Sohn, Founding Managing Partner at Walden Catalyst Ventures adds: “Nearfield Instruments is operating at the intersection of two powerful industry shifts: the rapid scaling of AI and the transition to increasingly complex 3D semiconductor architectures. As the semiconductor industry enters a critical new phase, advanced metrology and inspection will become essential enablers of the next generation of chip innovation. We are excited to continue supporting the company’s growth.”

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