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Sr. Integration Engineer

Join SMART Photonics B.V., a leading Indium Phosphide (InP) photonic foundry, where we work closely with customers to turn innovative ideas into high-performance photonic integrated circuits (PICs). As demand for backend services, including wafer finishing, assembly, packaging, and testing, continues to grow, we are expanding our Product & Integration Engineering (PIE) team with expertise in packaging and reliability. This team plays a crucial role in bridging frontend wafer fabrication with internal backend processes and reliability testing as well as with backend, packaging and testing executed with external partners.

Proven experience in semiconductor manufacturing, with a focus on InP photonic integration, backend processing, PIC packaging, and/or reliability. Hands-on experience in process development, optimization, and troubleshooting.

A Master’s degree or PhD in Integrated Photonics, Electrical Engineering, Materials Science, Physics, or related field.

Demonstrated ability to analyze reliability and process data, linking in-line and end-of-line (EOL) metrics to drive yield improvement and root cause analysis

Experience with Design-for-Packaging and/or Design-for-Reliability (DfX), including translating learnings into design rules or PDK improvements

Strong communication skills to work effectively in a cross-functional team environment.

Familiarity with software for design of PICs such as Klayout, Nazca, Luceda or similar.