The Ultimate Chiplet Interconnect. Period.
Eliyan’s Interconnect technology built with standard organic chip packaging delivers the same performance as advanced packaging technology, and enables The Ultimate Chiplet Systems at a fraction of total cost of ownership. Without the downsides of advanced packaging, you achieve higher number of cores, compute performance, test coverage, and yield.`

Technology
The transition from monolithic chips into discrete chiplets results in more powerful systems. And the industry is no longer depending on Moore’s Law to provide a path to higher performance, and lower energy at a reasonable cost and complexity. The race to chiplets has put the spotlight squarely on interconnects. Chiplet configurations require new technology optimized to deliver high bandwidth, low latency, and low power. Today, the Universal Chiplet Interconnect Express (UCIe) specification has defined these interconnects, enabling an open ecosystem and ubiquitous interconnect at the package level.

That’s where Eliyan comes in. NuLink™, the Eliyan interconnect solution, delivers performance and power/area efficiency that no other technology can offer. Our exclusive trade secrets and patent-protected technologies deliver a UCIe compliant interconnect at twice the bandwidth and half the power.

How is this possible? Because we have been at this for years, long before the industry standards were established. Inventing NuLink technology, incrementally improving it over the years, and taking it to volume production, have enabled us to achieve unprecedented characteristics.